The following powder and flake can be made into metallization pastes for SMD, and the pastes can be used in: 1. LTCC 2. Multi-layer passive components – SMD chip ( Capacitor MLCC, Inductor MLCI, Resistor Chip R ) 3. Chip components – SMD chip ( Varistor, PPTC, PTC/NTC, thermistor ) |