Industry：
Nano, Sub micro, Micro metal powder-Silver Powder, Copper Powder for Electronic Materials／Monodispersed fine spherical silver powder
2019 Catalogue of Silver Powder
Features:
1. High tap density:5.5±0.5 g/cm3
2. Well dispersiveness & Centralized partical distribution
3. High purity:4N
4. Complete in specification
5. Customized products
Application
Military, Aerospace & Green Energy		  Photovoltaic Metallization Pastes For Silicon Solar Cell
 Silver Powder For Zinc-Silver Battery
 Conductive Paste For Electronic Material
 Conductive Paste For Low Resistance Design 
 Conductive Paste For Optoelectronic Semiconductor Devices

Product 
Name		 Mean
Particle		 Particle Distribution(μ)
D10       D50       D90       Dmax
T.D.
g/cm3
AG 0647 0.70μm 0.2         0.6        1.3        3.40   4.7
AG 1061 1.14μm 0.6         1.1        1.7        3.90   6.1
AG 1258 1.27μm 0.7         1.2        1.9        3.91   5.8
AG 1558 1.62μm 1.0         1.5        2.4        5.12   5.8
AG 1858 1.87μm 1.1         1.8        2.7        5.87   5.8
AG 2055 2.10μm 1.3         2.0        3.0        5.87   5.5
AG 2556 2.63μm 1.7         2.5        3.8        7.70   5.6
AG 3053 3.23μm 2.0         3.0        4.8        10.0   5.3
AG 3356 3.30μm 1.9         3.1        5.0      10.10   5.6
AG 3552 3.56μm 2.3         3.4        5.1      10.10   5.2



    
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