Industry：
Metal Powder&Customized Product／Silver Powder for Electronic Components
Silver Powder For Multi-layer Electronic Components Pastes
The following powder and flake can be made into metallization pastes for SMD, and the pastes can be used in:
1. LTCC
2. Multi-layer passive components – SMD
chip ( Capacitor MLCC, Inductor MLCI,
Resistor Chip R )
3. Chip components – SMD chip ( Varistor,
PPTC, PTC/NTC, thermistor )

Spherical Powder Mean
Particle		 D10 D50 D90 DMax T.D.
Unit μm g/cm3
AG 1245 1.2 0.7 1.2 1.8 3.9 4.5
AG 1258 1.3 0.7 1.2 1.9 3.9 5.8
AG 1660 1.7 1.1 1.6 2.4 4.5 6.0
AG 1759 1.8 1.1 1.7 2.6 5.1 5.9
AG 2055 2.1 1.3 2.0 3.0 5.9 5.5
AG 2551 2.7 1.8 2.6 3.9 7.7 5.1
AG 3053 3.2 2.0 3.0 4.8 10.1 5.3
AG 3552 3.6 2.3 3.4 5.1 10.1 5.2


 AG 1245 


 AG 1258 


 AG 1660 


 AG 1759 


 AG 2055 


 AG 2551 


 AG 3053 


 AG 3552 




     Flake   Mean
Particle		 D10 D50 D90 DMax T.D.
Unit μm g/cm3
AG F 168  ≦4.0 1.8 3.7 7.4 17.4 3.5
AG F 230 ≦4.0 1.8 3.6 6.6 15.2 4.1

 AG F 168 


 AG F 230 
TEL：886-6-3557305
FAX：886-6-3559814
E-Mail：agpro@agpro.com.tw		 HIT：00083494
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