Industry：
Metal Powder&Customized Product／Silver Powder for Photoelectric Paste
Silver Powder For Photoelectric Pastes
The following powder and flake can be made into conductive pastes and conductive adhesives for printing, and the pastes can be used in:
1. Touch panel –
Medium-temperature conductive pastes
2. Touch panel, PET, PCB, FPC –
Photoresist, Low-temperature conductive
pastes
3. Solar panel, LED, IC, CPU –
Conductive & thermal paste and
Conductive adhesive
4. Switch, Circuit breaker, Relay ─
Electrical contact materials

Spherical Powder Mean
Particle		 D10 D50 D90 DMax T.D.
Unit μm g/cm3
AG 1053 1.1 0.6 1.1 1.8 3.9 5.3
AG 1245 1.2 0.7 1.2 1.8 3.9 4.5
AG 1258 1.3 0.7 1.2 1.9 3.9 5.8
AG 1557 1.6 1.0 1.5 2.3 4.5 5.7
AG 1660 1.7 1.1 1.6 2.4 4.5 6.0


 AG 1053 


 AG 1245 


 AG 1258 


 AG 1557 


 AG 1660 




     Flake    Mean
Particle		 D10 D50 D90 DMax T.D.
Unit μm g/cm3
 AG F 150   8.6 2.5 7.3 16.4 39.2 3.2
AG F 168 ≦4.0 1.8 3.7 7.4 17.4 3.5
AG F 230 ≦4.0 1.8 3.6 6.6 15.2 4.1
PF130 4.0 1.1 3.2 8.1 17.4 2.4
981-200 8-10 2.0 6.7 16.9 44.9 4.0
981-300 8-10 2.4 7.3 20.0 59.0 5.3
982-210 8-10 2.6 8.0 19.7 59.0 4.0


 AG F 150 


 AG F 168 


 AG F 230 


 PF130 


 981-200 


 981-300 
TEL：886-6-3557305
FAX：886-6-3559814
E-Mail：agpro@agpro.com.tw		 HIT：00083592
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