Industry:
Spherical Silver Powder
Nano, Sub micro, Micro metal powder-Silver Powder, Copper Powder for Electronic Materials
Metal Powder&Customized Product
Metal Powder&Customized Product
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Application of Low-temperature Die attache Silver Paste
Solvent-free low temperature three-in-one silver paste(conductive,radiating &die attache)
Spherical Powder
Mean
Particle
D10
D50
D90
DMax
T.D.
Unit
μm
g/cm3
AG 1061
0.7
0.6
1.1
1.7
3.9
6.1
AG 1258
1.3
0.7
1.2
1.9
3.9
5.8
AG 1558
1.6
1.0
1.5
2.4
5.1
5.8
AG 2556
2.6
1.7
2.5
3.8
7.7
5.6
AG 3552
3.6
2.3
3.4
5.1
10.1
5.2
AG 1061
AG 1258
AG 1558
AG 2556
AG 3552
Silver Flake
Mean
Particle
D10
D50
D90
DMax
T.D.
Unit
μm
g/cm3
981-320
8-10
2.5
7.5
18.6
59.0
5.5
981-260
8-10
3.3
10.0
22.7
67.5
4.8
981-142
8-10
3.8
10.3
23.3
67.5
3.5
981-320
981-260
981-142
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E-Mail:agpro@agpro.com.tw
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TNDG