Industry：
Nano, Sub micro, Micro metal powder-Silver Powder, Copper Powder for Electronic Materials／Monodispersed fine spherical silver powder
AG 3552
AG 3552 has characteristics of high purity, good dispersity, high tap density and low sintered shrinkage. The silver powder mainly used in electrode paste for multilayer components, and the medium-high temperature sintered conductive paste.
Mean Particle 3.56 μm
Particle Distribution  
D10 2.29 μm
D50 3.36 μm
D90 5.08 μm
DMax 10.10 μm
Tap Density 5.2 g/cm3
SEM
Distrbution Chart

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