AG PRO TECHNOLOGY CORP.
   

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1. Micro-nano spherical silver powder
 

1-1.

D50 : 1.0μm silver powder
 

1-2.

D50 : 2.0μm silver powder
 

1-3.

D50 : 1.0μm─14.0μm silver powder
2. Micro-nano silver flake
 

2-1.

D50 ≦2.0μm silver flake
 

2-2.

D50 ≦4.0μm silver flake
 

3-3.

D50 ≦14.0μm silver flake
3. Micro-nano silver powder
 

3-1.

D50 ≦1.0μm silver powder
 

3-2.

D50 ≦2.0μm silver powder
4. Micro-nano spherical copper powder
 

4-1.

D50 ≦2.0μm copper powder
5. Customized products
 

5-1.

Metal powder – silver powder, palladium powder, silver-palladium powder.
 

5-2.

Conductive metallization paste – silver metallization paste, palladium metallization paste, copper metallization paste.
 

 

5-2-1. Metallization paste for solar cell component

 

 

 

※ Reach fine finger grating height/width ratio, low resistance, and high IPCE.
 

 

5-2-2. Metallization paste for electronic component
 

 

  ※ Apply for passive components (LCR), thermistor (NTC, PTC, varistor), microwave devices, piezoelectric element, etc.
 

 

5-2-3. Conductive paste for optoelectronic semiconductor devices

 

 

 

※ Supply conductive adhesive paste and screen printing conductive paste for IC&LED, touch panel, PDP, PCB industries.
 

 

5-2-4. Functional conductive silver paste

 

 
TEL:886-6-3557305
FAX:886-6-3559814
E-Mail:agpro@agpro.com.tw
HIT:00070929
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